Where specialization meets certification.
Specialized services to meet industry specifications
The IECQ offers a specialized service known as "IECQ specialized process." This service is designed to ensure the consistent quality and reliability of specialized manufacturing processes used in the production of electronic components and assemblies. One of the specific processes covered under IECQ specialized process is the "ball grid array" (BGA) assembly process. It involves the attachment of tiny solder balls to the underside of an integrated circuit, which is then mounted onto the PCB. This process is widely used in modern electronics due to its ability to provide efficient electrical connections and improved thermal performance.
In the context of the avionics industry, BGAs are often utilized due to their compact size, high pin count, and superior electrical and thermal properties. Avionics systems require high levels of reliability and resilience to operate in challenging environments, including extreme temperatures, vibration, and electromagnetic interference. BGAs are well-suited for meeting these requirements and delivering efficient and reliable connections between integrated circuits and printed circuit boards.
The IECQ's specialized process service involves a comprehensive evaluation and certification of the manufacturing processes used in the production of components that may be unique and specialized to specific industries using applicable technical specifications.
This evaluation ensures that these processes adhere to stringent quality and reliability specifications or standards. The goal is to minimize defects, reduce the risk of component failure, and enhance the overall performance of electronic products.
Related documents
Get the briefing paper
IECQ Rules of Procedure
03-2
IECQ 03-2 ed.2.3 (EN)
IECQ Rules of Procedure - Part 2: IECQ Approved Process Scheme
Docs Spec process
IECQ 03-1 ed.3.1 (EN)
IECQ Rules of Procedure - Part 1: General Requirements for all IECQ Schemes
OD 015 ed.1.0 (EN)
Operational Document - IECQ On-Line Certificate of Conformity System Guidelines for creating IECQ On-Line Certificates of Conformity
IEC International Specification
IEC TS 62647-4:2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
How to get involved
Certification Bodies seeking to provide this IECQ service should submit an application to the IECQ Secretariat using the forms provided.
CB Application Forms
Form CB Application ed.9.0 (EN)
Standard Form MC-129-Q - IECQ CB Application Form
This form is to be completed by certification bodies seeking acceptance as an IECQ Certification Body (IECQ CB) and once completed is to be reviewed and endorsed by one of the IECQ Member Bodies (IECQ MBs) and then forwarded to the IECQ Secretariat as indicated on the form.
Form CB Extension of Scope ed.10.0 (EN)
Standard Form MC-130-Q - IECQ CB Application for Extension of Scope
This application & capability declaration form is to be completed by accepted IECQ Certification Bodies (IECQ CBs) when seeking to extend their scope of IECQ acceptance to other IECQ Services and new or revised Standards / Specifications. The completed form is then forwarded to the IECQ Secretariat as indicated on the form.