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Reference | Edition | Title | Downloads | Publication Date |
|---|---|---|---|---|
IEC 62239-1:2018 | 1.0 | Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan | 2018-09-24 | |
TN 005 | 2.0 | Technical Note - IECQ HSPM Certification to IECQ QC 080000 Edition 3.0 and recast RoHS Directive (2011765/EU) - Introduction Plan [Public Publication] | 2012-05-01 | |
IECQ AS 032000-JP0001 | 1.0 | IECQ Assessment Specification - Protection of electronic devices from electrostatic phenomena – General requirements | 2017-07-31 | |
IECQ CECC 200 024 | 1.0 | IECQ Process Assessment Schedule - Final Assessmbly of Electrical Connectors | 2016-04-15 | |
IECQ CS 001004 | 1.0 | IECQ Specifications list | 2006-03-01 | |
IECQ CS 033000-CN0001 | 1.0 | IECQ Component Specification - Refrigerator Smart Displayer Module – K182-RD-HR-BCD Series-0001 [Summary] | 2021-03-11 | |
IECQ CS 033000-CN0002 | 1.0 | IECQ Component Specification - CLGZ10E/CLHZ10E Wi-Fi Module MMKV23-350N – K182-CO-0001 [Summary] | 2021-05-25 | |
IECQ CS 033000-CN0003 | 1.0 | IECQ Component Specification - Wi-Fi Module 0021800073C – K182-WD-HR-Intelligent balcony Series-0001 [Summary] | 2021-03-18 | |
IECQ CS 033000-CN0004 | 1.0 | IECQ Component Specification - Smart Dishwasher Wi-Fi Modules MWB-S-WB01 and MDA1M115-3, – K182-CO-0001 [Summary] | 2022-06-06 | |
IECQ CS 033000-CN0005 | 1.0 | IECQ Component Specification - Smart Air Conditioner 2.4GHz Wi-Fi + Bluetooth Dual Modules MHCWB6G-B – K182-CO-0001 [Summary] | 2023-05-02 | |
IECQ CS 033000-UK0001 | 1.1 | IECQ Component Specification - e-Labelling | 2016-07-01 | |
IECQ CS 033200-TW0001 | 1.0 | IECQ Component Specification - Touch panels: Resistive touch panel | 2014-06-18 | |
IECQ CS 033200-TW0002 | 1.0 | IECQ Component Specification - Multi Layer Ceramic Capacitor (MLCC): X7R, Soft termination, 50~100V | 2015-09-01 | |
IECQ CS 033200-TW0003 | 1.0 | IECQ Component Specification - Multi Layer Ceramic Capacitor (MLCC): X7R, Soft termination, 200~250V | 2015-09-01 | |
IECQ CS 033200-TW0004 | 1.0 | IECQ Component Specification - Anti-Sulfurated Thick Film Chip Resistors (RMS series standard) | 2019-02-01 | |
IECQ CS 033200-TW0005 | 1.0 | IECQ Component Specification - Current Sensing Chip Resistors (RLM Series) | 2020-02-01 | |
IECQ CS 033200-TW0006 | 1.0 | IECQ Component Specification - Current Sensing Resistors (RLS Series) | 2020-12-01 | |
IECQ CS 033200-TW0007 | 1.0 | IECQ Component Specification - High Power Current Sensing Chip Resistors (RLP Series) | 2021-12-01 | |
IECQ CS 038000-CN0001 | 1.0 | IECQ Component Specification - Packaged LED: Type 3535 Standard Optical Component | 2016-09-01 | |
IECQ CS 038000-CN0002 | 1.0 | IECQ Component Specification - Packaged LED – Type 3014 Standard Optical Component | 2017-09-01 | |
IECQ CS 038000-CN0003 | 1.0 | IECQ Component Specification - Module LED – Type DL8901 Standard Optical Component | 2017-09-01 | |
IECQ CS 038000-CN0004 | 1.0 | IECQ Component Specification - Packaged LED – Type 2016 Standard Optical Component | 2017-09-01 | |
IECQ CS 038000-CN0005 | 1.0 | IECQ Component Specification - Packaged LED – Type 1010 Standard Display Component | 2017-09-01 | |
IECQ CS 042200-GB0001 | 1.0 | IECQ Component Specification - Varistors: Metal Oxide Varistor | 2015-11-01 | |
IECQ CS 32100-A001 | 5.0 | IECQ Assessment Specification - Multilayer Ceramic Capacitors - C0G, dielectric constant range 10 - 100, X7R, dielectric constant range 1000 - 4000. | 2022-05-01 | |
IECQ CS 32100-C001 | 4.0 | IECQ Component Specification - Multilayer Ceramic Capacitors - C0G, dielectric constant range 10 - 100, X7R, dielectric constant range 1000 - 4000 | 2022-05-01 | |
IECQ CS 440004-DE0001 | 1.0 | IECQ Component Specification - Thermistors – Directly heated positive temperature coefficent – Part DE0001: Sensing application – Assessment level EZ THERMISTORSl | 2013-02-01 | |
IECQ CS 88000-A001 | 8.0 | IECQ Assessment Specification - Ceramic Hermetically Sealed - Transistor Optocouplers | 2014-06-01 | |
IECQ CS 88000-C001 | 8.0 | IECQ Component Specification - Ceramic Hermetically Sealed - Transistor Optocouplers | 2013-05-01 | |
IECQ CS 88000-C002 | 1.0 | IECQ Component Specification - Ceramic Hermetically Sealed High Speed Optocouplers | 2007-03-20 | |
IECQ CS 88000-C002 | 5.0 | IECQ Component Specification - Ceramic Hermetically Sealed - High Speed Optocouplers | 2013-05-01 | |
IECQ CS 88000-C003 | 8.0 | IECQ Component Specification - Ceramic Hermetically Sealed - High Gain Optocouplers | 2013-05-01 | |
IECQ CS 88000-C004 | 4.0 | IECQ Component Specification - Ceramic Hermetically Sealed - High Gain Photon Optocouplers | 2013-05-01 | |
IECQ QC 080000 | 4.0 | IECQ Specification - Hazardous Substance Process Management System Requirements (HSPM) | 2017-05-12 | |
TN 022 | 1.0 | Technical Notice - Amendment No. 1 to IECQ QC 080000:2017 Edition 4.0 [Public Publication] | 2020-03-03 | |
IECQ QC 080000 CSV | 4.1 | IECQ Specification - Hazardous Substance Process Management System Requirements (HSPM) - IECQ QC 080000:2017 + IECQ TN022:2020 CSV | 2022-06-30 |
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